New research from CORPE

A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High Power IGBT Modules By Amir Sajjad Bahman, Ke Ma and Frede Blaabjerg

Last modified: 03.01.2018

Published in: IEEE Transactions on Power Electronics

DOI (link to publication from Publisher): 10.1109/TPEL.2017.2694548

Figure 1: 3D thermal network from chip (junction) to reference (cooling system)

Figure 2: Test set up featured with IR camera


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